|
SolderabilityThis test is used to evaluate the ease of solderability of the soldering connections of the relay. Usually, the test is performed by immersion in a solder bath at 235 °C. It tests how well the soldering connections are wet by the liquefied solder, i.e. whether a good adhesive, smooth coating of solder with only few blemishes is achieved. Normally, the test piece is subjected to accelerated aging before being tested (e.g. 4 h at 155 °C dry heat). The evaluation of the surface is performed by visual inspection or with the help of a magnifying glass. This test is performed according to the IEC 68-2-20, Ta test. |