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Relay Resistance to Soldering Heat

This test is used to evaluate the resistance of the soldering connections of the relay to damage by heat stress in the solder process during mounting.

As a rule, the test is performed by immersing the soldering connections in a solder bath at 260 °C. The immersion time is either 5 s or 10 s. A thin screen of heat insulating material may be placed between the relay and solder bath.

This test is performed according to the IEC 68-2-20, Tb test.